Ref:
A72.252FHA.00144

A72.252FHA.00144

Brand :
APACER

SV250-300 mSATA 32GB 256Gb*1 ET Thermal Sensor DEVSLP Apacer internal PN for flash chip : 61.F3SA0.3133B - TO-BiCS3 32768x8 3D TLC TSOP toggle2.0 3K P/E -40 ~ +85°C Industrial, FW SFMB0130, Brand :Kioxia

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ModelSV250-300 InterfaceSATA 3.2 (6Gb/s) Connector52-pin mSATA connector Form FactorJEDEC MO-300 NAND Flash Type3D TLC Capacity30GB~480GB External DRAMNo Sustained Read Performance (MB/sec)Up to 560 Sustained Write Performance (MB/sec)Up to 515 ECC EngineLow-Density Parity-Check (LDPC) Code IOPS (4K Random Write)71K Standard Operating Temperature ( °C )0 ~ + 70 Extended Operating Temperature ( °C )-40 ~ + 85 Storage Temperature ( °C )-40 ~ + 100 Thermal SensorYes ShockOperation: 50G/11ms Non-operation: 1500G/0.5ms (compliant with MIL-STD-883K) VibrationOperation: 7.69 Grms, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operation: 4.02 Grms, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) Operating Voltage3.3 V ± 5% Power consumption Power ConsumptionActive mode:390 mA / Idle mode: 70 mA Dimension (L x W x H )50.80 x 29.85 x 4.85mm MTBF (hours)>3,000,000 TechnologyAES 256-bit Encryption / CoreAnalyzer2 / DataDefender™ / DataRAID™ / DEVSLP / Page Mapping / S.M.A.R.T. / SSDWidget 2.0 / Thermal Sensor / Wide Temperature
Technical features
Sensor
Resolution
Focus type
Operating Temperature
Interface
Sensor type
Supported OS
Screen size
Memory type
SSD
Type of technology
Form factor
mSATA
Screen size
Processor type
Type of architecture
Type of architecture
Heat dissipation
Processor type
Form factor
Type of architecture
Heat dissipation
Processor type
Form factor
Temperature range
Type of architecture
Processor type
Heat dissipation
Temperature range
Form factor
Length
Width
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